? semiconductor components industries, llc, 2012 march, 2012 ? rev. 1 1 publication order number: nom02a4 ? ag01g/d NOM02A4-AG01G 200dpi contact image sensor module description the nom02a4 ? ag01g contact image sensor (cis) module integrates a green led light source, lens and image sensor in a compact housing. the module is designed for document scanning, mark reading, gaming and office automation equipment applications and is suitable for scanning documents up to 216 mm wide. an analog video output achieves a scanning rate of 1.728 ms/line. the nom02a4 ? ag01g module employs pr oprietary cmos image sensing technology from on semiconductor to achieve high ? speed performance and high sensitivity. features ? light source, lens and sensor are integrated into a single module ? 216 mm scanning width at 7.9 dots per mm resolution ? 1.728 msec/line scanning speed @ 1.0 mhz pixel rate ? analog video output ? supports a4 paper size at up to 15 pages per minute ? green led light source ? wide dynamic range ? compact 232.1 mm x 19.2 mm x 13.7 mm module housing ? low power ? light weight 2.1 oz packaging ? these devices are pb ? free, halogen free/bfr free and are rohs compliant applications ? gaming machines ? fax machines and document scanning ? mark readers including balloting and test scoring ? office automation equipment motor contact image sensor module paper insertion sensing switch motor controller and driver scan system timing and control analog to digital converters parallel port transceiver led drivers dsp figure 1. typical scanner application http://onsemi.com image sensor module a4 case modac marking diagram yy = year mm = month ssssss = serial number g = pb ? free package connector pin assignment see detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. ordering information vled gled vss cp gnd sp vdd gnd vout 123 10 45 9 8 67 nom02a4 ? ag01g yymmssssss gnd
nom02a4 ? ag01g http://onsemi.com 2 table 1. ordering information part number package shipping configuration nom02a4 ? ag01g (pb ? free) 100 per packing carton 1 2 3 4 1728 shift register photo sensor array rod lens buf buf vled gled vdd (+5 v) gnd vss ( ? 5 v) sp cp green led light bar pixel 1 corresponds to connector end of the module amp vout 1 2 3 4 figure 2. simplified block diagram table 2. pin function description pin pin name description 1 vout analog video output 2 gnd ground 3 vdd +5 v power supply 4 vss ? 5 v to ? 12 v power supply 5 gnd ground 6 sp shift register start pulse 7 gnd ground 8 cp sampling clock pulse 9 gled ground for the led light source 10 vled power supply for the led light source
nom02a4 ? ag01g http://onsemi.com 3 table 3. absolute maximum ratings parameter symbol value unit power supply voltage v dd 7 v v ss ? 15 v v led 6 v power supply current i led 600 ma input voltage range for sp, cp v in ? 0.5 to v dd + 0.5 v storage temperature t stg ? 20 to 75 c storage humidity, non ? condensing h stg 10 to 90 % esd capability, contact discharge (note 1) esd hbm 2 kv stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. this module assembly has been esd tested to iec61000 ? 4 ? 2 (hbm) contact discharge table 4. recommended operating ranges (unless otherwise specified, these specifications apply t a = 25 c) (note 2) parameter symbol min typ max unit power supply voltage (note 3) v dd 4.5 5 5.5 v v ss ? 12 ? 5 ? 4.5 v v led 4.5 5 5.5 v power supply current i dd 53 60 67 ma i ss 5.0 6.0 7.0 ma i led 400 450 500 ma low level input voltage for sp, cp v il 0 0 0.8 v high level input voltage for sp, cp v ih 4.5 5.0 v dd + 0.3 v line scanning rate (note 4) t int 6.91 1.728 0.864 ms clock frequency (note 5) f 0.25 1.0 2.0 mhz clock period t o 0.5 1.0 4.0 s clock pulse width (note 6) t w 125 250 1000 ns clock pulse high duty cycle dc cp 20 25 60 % start pulse width (note 6) t wsp 150 180 480 ns start pulse setup time t su 20 ns start pulse hold time t h 20 ns prohibit crossing time (note 7) t prh 20 ns clock to video output propagation delay rising t pcor 150 ns clock to video output propagation delay falling t pcof 20 ns operating temperature t op 0 50 c operating humidity, non ? condensing h op 10 60 % 2. refer to figure 3 for more information on ac characteristics 3. v led directly affects illumination intensity, which directly affects v out . 4. t int is the line scanning rate or integration time. t int is determined by the interval between two start pulses. the clock is proportional to t int . 5. main clock frequency (f) corresponds to the video sampling frequency. 6. min, typ, max specifications reflect operation at the corresponding min, typ, max clock frequency. 7. prohibit crossing time is to insure that two start pulses are not supplied in the same scan line time. sp may only be active high during one falling edge of cp for any given scan.
nom02a4 ? ag01g http://onsemi.com 4 table 5. physical specifications parameter symbol typ unit scan width pd w 216 mm number of photo detector arrays pda n 27 arrays number of photo detectors pd n 1728 elements table 6. physical characteristics parameter symbol min typ max unit pixel pitch pd sp 125 m inter ? array spacing pda sp 150 180 210 m inter ? array vertical alignment pda vxp ? 40 0 40 m green led peak wavelength p 561 575 nm table 7. electro ? optical characteristics test conditions parameter symbol value unit power supply voltage v dd 5.0 v v ss ? 5.0 v v led 5.0 v clock frequency f 1.0 mhz clock pulse high duty cycle dc cp 25 % line scanning rate t int 1.728 ms led arrays pulsed time on (note 8) led_ton 26 ms led arrays pulsed time off (note 8) led_toff 356 ms operating temperature t op 25 c 8. production tested with pulsing leds.
nom02a4 ? ag01g http://onsemi.com 5 table 8. electro ? optical characteristics (unless otherwise specified, these specifications were achieved with the test conditions defined in table 7) parameter symbol min typ max unit bright analog output voltage (note 9) v pavg 0.9 1.0 1.1 v bright output non ? uniformity (note 10) u p ? 30 30 % bright output non ? uniformity total (note 11) u ptotal 60 % adjacent pixel non ? uniformity (note 12) u padj 25 % dark output voltage (note 13) v d 200 mv dark non ? uniformity (note 14) u d 200 mv modulation transfer function at 50 line pairs per in (lp/in) (note 15) mtf 50 40 % modulation transfer function at 100 line pairs per in (lp/in) (notes 15, 16) mtf 100 20 % 9. v pavg = v p(n) /1728, where v p is the pixel amplitude value of v out for a bright signal defined as a white document with leds turned on, n is the sequential pixel number in one scan line. 10. u p = [(v pmax ? v pavg )/v pavg ] x 100%, or [v pavg ? v pmin )/v pavg ] x 100%, whichever is greater, where v pmax is the maximum pixel voltage of any pixel at full bright v pmin is the minimum pixel voltage of any pixel at full bright 11. u ptotal = [(v pmax ? v pmin )/v pavg ] x 100%, 12. u padj = max [ | (v p(n) ? v p(n+1) | / v p(n) ] x 100%, where u padj is the nonuniformity in percent between adjacent pixels for a bright background 13. v d is the pixel amplitude value of v out for a dark signal defined as a black document with leds turned off 14. u d = v dmax ? v dmin , where v dmax is the maximum pixel voltage of any dark pixel with the leds turned off v dmin is the minimum pixel voltage of any dark pixel with the leds turned off 15. mtf = [(v max ? v min )/(v max + v min )] x 100%, where v max is the maximum output voltage at the specified line pairs per inch (lp/in) v min is the minimum output voltage at the specified lp/in 16. for information only. figure 3. timing diagram cp sp vout pixel 1 pixel 2 pixel 3 pixel 4 gnd t wsp t su t prh t h t prh t w t pcof v d v p t o t pcor
nom02a4 ? ag01g http://onsemi.com 6 description of operation functional description the nom02a4 ? ag01g module consists of 27 contact image sensors, each with 64 pixel elements, that are cascaded to provide 1728 photo ? detectors with their associated multiplex switches and double ? buffered digital shift register that controls its sequential readout. a buffer amplifies the video pixels from the image sensors and output the analog video signal of the module as shown in figure 2. in operation, the sensors produce an analog image pixel signal (or video signal) proportional to the exposure on the corresponding picture elements on the document. the vout signal outputs 1728 pixels for each scan line. the first bit shifted out from vout during each scan represents the first pixel on the connector end of the module. a pictorial of the nom02a4 ? ag01g cross section view is shown in figure 4. mounted in the module is a one ? to ? one graded ? index micro lens array that focuses the scanned document image onto the sensing plane. illumination is accomplished by means of an integrated led light source. all components are housed in a small plastic housing, which has a glass cover. the top surface of the glass acts as the focal point for the object being scanned and protects the imaging array, micro lens assembly and led light source from dust. pcb sensors rod lens led bar module housing document surface glass window light path figure 4. module cross section view connector pin out description connections to the module are via a 2.4x14.50mm 10 ? pin connector (ece part number ebw ? pk23 ? p010l2 ? 3z) located at one end of the module as shown in the package drawing on page 8. the location of pin number 1 is indicated on the package drawing. scanner applications a typical use of the nom02a4 ? ag01g module in scanner applications is shown in figure 6. the document to be digitized is fed into the scanner where a sensor detects its presence. the scanner then operates the motor to move the paper under the contact image sensor module. the module illuminates the paper with internal leds and the image sensor pixel array detects the amount of reflected light and simultaneously measures a full line of pixels which are sampled and transferred to a fifo for storage and conversion to a parallel output format. once the pixel line is processed, the motor advances the paper and the next scan line is captured. initialization document detected? start scan sp= , cp= ctr=0 transfer scan line data done ctr++ == 1728 no no yes document detected? cp= initialization document detected? start scan sp= , cp= ctr=0 read pixel into memory transfer scan line data done no no yes document detected? cp= figure 5. typical scanner algorithm figure 5 outlines the basic steps in the scanner control sequence. first the circuits are initialized and the scanner waits for a document to be detected, usually by a paper sensing switch. then a start pulse and clock pulse are supplied to capture a line image. at the next clock pulse the first pixel value appears on the output. the pixel can be stored in a local line buffer memory. subsequent clocks cause the remaining pixels to be shifted out and stored in the line buffer. once the complete line has been shifted out it can be transferred to the host application and the system advances the paper and the line scan process repeats until the paper sensing switch indicates the document has passed completely through the scanner. device marking and barcode description each module is marked with a tag that contains the part number, a number combining the manufacturing date code and serial number and a barcode. the barcode presents the date code and serial number in interleave 2 of 5 barcode format as follows yymmssssss where yy is the year, mm is the month, and ssssss is the serial number. glass lens care precautions should be taken to avoid scratching or touching the glass lens. the glass lens may be cleaned with alcohol.
nom02a4 ? ag01g http://onsemi.com 7 figure 6. typical scanner assembly
nom02a4 ? ag01g http://onsemi.com 8 package dimensions image sensor module a4 case modac issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. leading edge of the approach angle on the glass is lower than the top of the housing. 4. bore depth is 6.0 with a 0.3 lead ? in chamfer. 5. pin header, model number ebw ? pk23 ? p010l2 ? 3z, 1x10 pin, pitch 1.25. 6. glass is glued on all 4 sides. 7. glass thickness is 1.85. 8. use m2.3 self tapping screws for mounting. torque screws between 1.80 kgf ? cm and 2.00 kgf ? cm. 9. dimension d1 denotes the scan length. 10. dimension k denotes the position of the first pixel. dim a min max 12.60 13.60 millimeters a1 5.45 6.45 b 17.70 18.30 b1 18.90 19.50 d1 216.00 ref e 2.10 2.30 f 112.50 113.50 h 34.80 35.80 j 5.70 6.30 k 5.30 7.30 l b2 5.50 6.50 c 15.40 15.60 d 231.60 232.60 6.00 ref a2 13.20 14.20
nom02a4 ? ag01g http://onsemi.com 9 packing dimensions no. name material 1 shockproof pad epe 2 packing tray polyfoam 3 conduct electricity sheet pe + conductive sheet 4 waterproof bag pe 5 packing box ? carton kraft paper on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. nom02a4 ? ag01g/d publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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